The PolyZen device is a thermally protected, precision Zener diode that helps protect circuits from damage caused by overvoltage and overcurrent fault conditions.
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Part Number
VZ
(V)
IZT
(A)
IHOLD
@ 20ºC
(A)
R Typ
Ω
R1MAX
Ω
VINT Max
IFLT Max
Min.
Typ.
Max.
VINT Max
(V)
VINT
Test Current (A)
IFLT
Max (A)
IFLT
Test Voltage (v)
ZEN056V130A24LS
5.45
5.60
5.75
0.1
1.3
0.12
0.16
24V
3A
+10/-40
+24/-16V
ZEN065V130A24LS
6.35
6.50
6.65
0.1
1.3
0.12
0.16
24V
3A
+6/-40
+24/-16V
ZEN098V130A24LS NEW
9.60
9.80
10.00
0.1
1.3
0.12
0.16
24V
3A
+3.5/-40
+24/-16V
ZEN132V130A24LS
13.20
13.40
13.60
0.1
1.3
0.12
0.16
24V
3A
+2/-40
+24/-16V
ZEN164V130A24LS
16.10
16.40
16.60
0.1
1.3
0.12
0.16
24V
3A
+1.25/-40
+24/-16V
ZEN056V230A16LS
5.45
5.60
5.75
0.1
2.3
0.04
0.06
16V
5A
+5/-40
+16/-12V
ZEN065V230A16LS
6.35
6.50
6.65
0.1
2.3
0.04
0.06
16V
5A
+3.5/-40
+16/-12V
ZEN132V230A16LS NEW
13.20
13.40
13.60
0.1
2.3
0.04
0.06
16V
5A
+2/-40
+20/-12V
ZEN056V075A48LS Coming Soon*
5.45
5.60
5.75
0.1
0.75
0.28
0.45
48V
3A
+10/-40
+48/-16V
ZEN132V075A48LM NEW
13.20
13.40
13.60
0.1
0.75
0.28
0.45
48V
3A
+2/-40
+48/-16V
ZEN056V115A24LS NEW
5.45
5.60
5.75
0.1
1.15
0.15
0.18
24V
3A
+10/-40
+24/-16V
ZEN056V130A24GS NEW
5.45
5.60
5.75
0.1
1.30
0.12
0.18
24V
3A
+6/-40
+24/-16V
ZEN059V130A24LS NEW
5.80
5.90
6.00
0.1
1.30
0.12
0.15
24V
3A
+6/-40
+24/-16V
* Data is Preliminary
All parts RoHS compliant
Part Numbering System for PolyZen Devices
Definitions
VZ
Zener clamping voltage measured at current IZt and 20°C.
IZT
Test current at which VZ is measured.
IHOLD
Maximum steady state IPTC that will not generate a trip event at the specified temperature. Ratings assume IFLT = 0A.
R Typ
Typical resistance between VIN and VOUT pins when the device is at room temperature.
R1MAX
The maximum resistance between VIN and VOUT pins at room temperature, one hour after first trip or after reflow soldering.
IFLT
Current flowing through the Zener diode.
IFLT
Max
Maximum RMS fault current the Zener diode component of the device can withstand and remain
resettable; testing is conducted at rated voltage with no load connected to VOUT.
VINT Max
The voltage (VIN - VOUT "post trip") at which typical qualification devices (98% devices , 95% confidence) survived at least 100 trip cycles and 24 hours trip endurance when "tripped" at the
specified voltage and current(IPTC).
Trip Event
A condition where the PPTC transitions to a high resistance state, thereby limiting IPTC, and
significantly increasing the voltage drop between VIN and VOUT.
Recommended reflow methods:
Hot air
Nitrogen
Recommendations:
Devices can be cleaned using standard methods and aqueous solvents.
Tyco Electronics believes that the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each solder pad. As such, Tyco Electronics requests that customers comply with our recommended solder pad layouts.
Tyco Electronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.
All information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the suitability of and test
each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the
information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Tyco Electronics’ Standard
Terms and Conditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential
damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition,
Tyco Electronics reserves the right to make changes to materials or processing that do not affect
compliance with any applicable specification without notification to buyer.